cystech electronics corp. spec. no. : c724x8 issued date : 2009.06.12 revised date : page no. : 1/9 MSFA0M02X8 cystek product specification p-channel logic level enhancement mo de mosfet with schottky diode MSFA0M02X8 mosfet product summary sc hottky product summary bv dss -20v v ka 20v r dson(max) v f 0.46v 100m i f 1a i d -3a features ? simple drive requirement ? low on-resistance ? fast switching speed ? pb-free lead plating and halogen-free package symbol outline dfn3 2 g gate s source a: anode d drain k: cathode
cystech electronics corp. spec. no. : c724x8 issued date : 2009.06.12 revised date : page no. : 2/9 MSFA0M02X8 cystek product specification absolute maximum ratings (t a =25 c, unless otherwise noted) parameter symbol limits unit drain-source breakdown voltage bv dss -20 v gate-source voltage v gs 12 v continuous drain current @t a =25 c i d -3 continuous drain current @t a =70 c i d -2.4 pulsed drain current (note 1) i dm -12 average forward current (schottky) i f 1 pulsed forward current (schottky) i fm 3 a t a =25 c 1.5 power dissipation (mosfet) t a =70 c 0.9 t a =25 c 1.2 power dissipation (schottky) t a =70 c p d 0.76 w operating junction and storage temp erature range tj; tstg -55~+150 c note : 1. pulse width limited by maximum junction temperature. duty cycle 1%. thermal resistance ratings parameter symbol maximum unit thermal resistance, junction-to-case(mosfet) r th,j-c 40 thermal resistance, junction-to-ambient(mosfet) r th,j-a 85 thermal resistance, junction-to-case(schottky) r th,j-c 50 thermal resistance, junction-to-ambient(schottky) r th,j-a 105 c/w electrical characteristics (t a =25 c, unless otherwise noted) symbol min. typ. max. unit test conditions static bv dss -20 - - v v gs =0v, i d =-250 a v gs(th) -0.3 -0.75 -1.2 v v ds =v gs , i d =-250 a i gss - - 100 na v gs =12v, v ds =0v - - -1 a v ds =-16v, v gs =0v i dss - - -10 a v ds =-16v, v gs =0, t j =125c i d(on) -3 - - a v ds =-5v, v gs =-4.5v - 85 100 i d =-3a, v gs =-4.5v *r ds(on) - 120 150 m i d =-2.5a, v gs =-2.5v *g fs - 4.5 - s v ds =-5v, i d =-3a dynamic ciss - 1033 - coss - 386 - crss - 367 - pf v ds =-10v, v gs =0, f=1mhz rg - 6.5 - v gs =15mv, v ds =0v, f=1mhz
cystech electronics corp. spec. no. : c724x8 issued date : 2009.06.12 revised date : page no. : 3/9 MSFA0M02X8 cystek product specification *t d(on) - 15 - *t r - 30 - *t d(off) - 35 - *t f - 30 - ns v ds =-10v, i d =-1a, v gs =-4.5v, r gs =6 *qg - 10 - *qgs - 3.6 - *qgd - 3 - nc v ds =-10v, i d =-3a, v gs =-4.5v source-drain diode *v sd - - 1.2 v v gs =0v, i f =i s *i s - - -2.5 a *i sm - - -10 a *pulse test : pulse width 300 s, duty cycle 2% schottky electrical characteristics (t a =25 c, unless otherwise noted) symbol min. typ. max. unit test conditions - 0.40 0.46 i f =0.5a - 0.47 0.56 i f =1a *v f - 0.44 0.53 v i f =1a, t j =125 c - 0.008 0.08 v r =5v - 2.8 28 v r =5v, t j =125 c - 0.009 0.09 v r =20v i rm ma v r =20v, t j =125 c - 3.2 32 c t - 30 - pf v r =10v *pulse test : pulse width 300 s, duty cycle 2% recommended footprint
cystech electronics corp. spec. no. : c724x8 issued date : 2009.06.12 revised date : page no. : 4/9 MSFA0M02X8 cystek product specification characteristic curves
cystech electronics corp. spec. no. : c724x8 issued date : 2009.06.12 revised date : page no. : 5/9 MSFA0M02X8 cystek product specification characteristic curves(cont.)
cystech electronics corp. spec. no. : c724x8 issued date : 2009.06.12 revised date : page no. : 6/9 MSFA0M02X8 cystek product specification schottky characteristic curves
cystech electronics corp. spec. no. : c724x8 issued date : 2009.06.12 revised date : page no. : 7/9 MSFA0M02X8 cystek product specification dfn3 2 dimension *: typical inches 8-lead dfn3 2 plastic package cys t ek pa ckage code: x 8 marking: device name date code millimeters inches millimeters dim min. max. min. max. dim min. max. min. max. a 0.0276 0.0354 0.70 0.90 e1 *0.0689 *1.75 a1 0.0000 0.0020 0.00 0.05 e *0.0256 *0.65 b 0.0094 0.0138 0.24 0.35 l 0.0079 0.0157 0.20 0.40 c 0.0031 0.0098 0.08 0.25 l1 0.0000 0.0039 0.00 0.10 *3.00 1 0 12 0 12 d *0.0118 e *0.0079 *2.00 notes: 1.controlling dimension: millimeters. 2.maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material. 3.if there is any question with packing specification or packing method, please c ontact your local cystek sales office. material: ? lead: pure tin plated ? mold compound: epoxy resin family, flammability solid burning class: ul94v-0 important notice: ? all rights are reserved. reproduction in whole or in part is prohibited without the prior written approval of cystek. ? cystek reserves the right to make changes to its products without notice. ? cystek semiconductor products are not warranted to be suitable for use in life-support applications, or systems. ? cystek assumes no liability for any consequence of customer pr oduct design, infringement of pat ents, or application assistance .
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